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 SMD Type
200V P-Channel MOSFET KQB12P20
TO-263
+ .1 1 .2 7 -00.1
Transistors IC
Unit: mm
+0.1 1.27-0.1 +0.2 4.57-0.2
Features
-11.5A, -200V, RDS(on) = 0.47 Low gate charge ( typical 31 nC) @VGS = -10 V
100% avalanche tested
+ .2 5 .2 8 -00.2
+0.1 1.27-0.1
0.1max
+0.1 0.81-0.1
Improved dv/dt capability
2.54
+0.2 -0.2 +0.1 5.08-0.1
+ .2 2 .5 4 -00.2
+ .2 1 5 .2 5 -00.2
Fast switching
+ .2 8 .7 -00.2
2.54
+0.2 0.4-0.2
Absolute Maximum Ratings Ta = 25
Parameter Drain to Source Voltage Drain Current Continuous TC=25 Drain Current Continuous TC=100 Drain Current - Pulsed Gate-Source Voltage Single Pulsed Avalanche Energy (Note 2) Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power dissipation @ Ta=25 Power dissipation @ Tc=25 Derate above 25 Operating and Storage Temperature Range Maximum lead temperature for soldering purposes,1/8" from case for 5 seconds Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient * Thermal Resistance Junction to Ambient TJ, TSTG TL R R R
JC JA JA
Symbol VDSS ID (Note 1) IDM VGSS EAS IAR EAR dv/dt
Rating -200 -11.5 -7.27 -46 30 810 -11.5 12 -5.5 3.13
Unit V A A A V mJ A mJ V/ns W W W/
(Note 1) (Note 1) (Note 3)
PD
120 0.96 -55 to 150 300 1.04 40 62.5
/W /W /W
* When mounted on the minimum pad size recommended (PCB Mount)
5 .6 0
Low Crss ( typical 30pF)
1 gate 1 Gate 2 drain 2 Drain 3 source 3 Source
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1
SMD Type
KQB12P20
Electrical Characteristics Ta = 25
Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage, Forward Gate-Body Leakage, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Note: 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 9.2mH, IAS = -11.5A, VDD = -50V, RG = 25 3. ISD -11.5A, di/dt 300A/ s, VDD , Starting TJ = 25 IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr VGS = 0 V, IS = -11.5 A VGS = 0 V, IS = -11.5 A, dIF / dt = 100 A/ s (Note 4) VDS = -160 V, ID = -11.5 A,VGS = -10 V(Note4,5) VDD = -100V, ID = -11.5 A,RG = 25 (Note4,5) VDS = -25 V, VGS = 0 V,f = 1.0 MHz Symbol BVDSS Testconditons VGS = 0 V, ID = -250 ID = -250 A
Transistors IC
Min -200
Typ
Max
Unit V V/
A, Referenced to 25 -1 -10 -100 100 A -3.0 0.36 6.4 920 190 30 20 195 40 60 31 8.1 16 -11.5 -46 -5.0 180 1.44 1200 250 40 50 400 90 130 40 -5.0 0.47
VDS = -200 V, VGS = 0 V VDS = -160V, TC=125 VGS = -30 V, VDS = 0 V VGS = 30V, VDS = 0 V VDS = VGS, ID = -250
A A nA nA V
VGS = -10 V, ID = -5.75A VDS = -40 V, ID = -5.75A
S pF pF pF ns ns ns ns nC nC nC A A V ns c
BVDSS, Starting TJ = 25 2%
4. Pulse Test : Pulse width
300 s, Duty cycle
5. Essentially independent of operating temperature
2
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